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(footprint "C0603K" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(descr "<b>Ceramic Chip Capacitor KEMET 0603 reflow solder</b><p>\nMetric Code Size 1608")
(fp_text reference "REF**" (at -0.8 -0.65) (layer "F.SilkS")
(effects (font (size 0.93472 0.93472) (thickness 0.08128)) (justify left bottom))
(tstamp 19752abc-a0f1-4347-8933-776fdcd29c33)
)
(fp_text value ">VALUE" (at -0.8 1.65) (layer "F.Fab")
(effects (font (size 0.93472 0.93472) (thickness 0.08128)) (justify left bottom))
(tstamp 8705b225-1869-4f01-a47a-06e1f577eac3)
)
(fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer "F.Fab") (width 0.1016) (tstamp 07967eb3-13c7-4e17-821d-8965a943209b))
(fp_line (start 0.725 0.35) (end -0.725 0.35) (layer "F.Fab") (width 0.1016) (tstamp b6be71d2-565d-4149-b71f-ceb374c1f2c7))
(fp_poly (pts
(xy -0.8 0.4)
(xy -0.45 0.4)
(xy -0.45 -0.4)
(xy -0.8 -0.4)
) (layer "F.Fab") (width 0) (fill solid) (tstamp 14f68a42-29d3-408d-a4c2-a03fe287ad69))
(fp_poly (pts
(xy 0.45 0.4)
(xy 0.8 0.4)
(xy 0.8 -0.4)
(xy 0.45 -0.4)
) (layer "F.Fab") (width 0) (fill solid) (tstamp ced18fc0-8f3c-44cd-b0d0-2a198c3129ad))
(pad "1" smd rect (at -0.875 0) (size 1.05 1.08) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 4fd8d017-88ba-45bc-9f34-59e8cfe86e83))
(pad "2" smd rect (at 0.875 0) (size 1.05 1.08) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 0d95e8bd-bb2f-4279-b9a1-415124832050))
)
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