(footprint "C0603K" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (descr "<b>Ceramic Chip Capacitor KEMET 0603 reflow solder</b><p>\nMetric Code Size 1608")
  (fp_text reference "REF**" (at -0.8 -0.65) (layer "F.SilkS")
    (effects (font (size 0.93472 0.93472) (thickness 0.08128)) (justify left bottom))
    (tstamp 19752abc-a0f1-4347-8933-776fdcd29c33)
  )
  (fp_text value ">VALUE" (at -0.8 1.65) (layer "F.Fab")
    (effects (font (size 0.93472 0.93472) (thickness 0.08128)) (justify left bottom))
    (tstamp 8705b225-1869-4f01-a47a-06e1f577eac3)
  )
  (fp_line (start -0.725 -0.35) (end 0.725 -0.35) (layer "F.Fab") (width 0.1016) (tstamp 07967eb3-13c7-4e17-821d-8965a943209b))
  (fp_line (start 0.725 0.35) (end -0.725 0.35) (layer "F.Fab") (width 0.1016) (tstamp b6be71d2-565d-4149-b71f-ceb374c1f2c7))
  (fp_poly (pts
      (xy -0.8 0.4)
      (xy -0.45 0.4)
      (xy -0.45 -0.4)
      (xy -0.8 -0.4)
    ) (layer "F.Fab") (width 0) (fill solid) (tstamp 14f68a42-29d3-408d-a4c2-a03fe287ad69))
  (fp_poly (pts
      (xy 0.45 0.4)
      (xy 0.8 0.4)
      (xy 0.8 -0.4)
      (xy 0.45 -0.4)
    ) (layer "F.Fab") (width 0) (fill solid) (tstamp ced18fc0-8f3c-44cd-b0d0-2a198c3129ad))
  (pad "1" smd rect (at -0.875 0) (size 1.05 1.08) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 4fd8d017-88ba-45bc-9f34-59e8cfe86e83))
  (pad "2" smd rect (at 0.875 0) (size 1.05 1.08) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 0d95e8bd-bb2f-4279-b9a1-415124832050))
)