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(footprint "WS2812B" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(fp_text reference "REF**" (at 3.4925 -1.5875 90) (layer "F.SilkS")
(effects (font (size 0.73152 0.73152) (thickness 0.08128)) (justify right top))
(tstamp 0093de83-9e43-4f53-a7ca-d3eb86514f47)
)
(fp_text value "" (at 0 0) (layer "F.Fab")
(effects (font (size 1.27 1.27) (thickness 0.15)))
(tstamp f96e8120-d495-4e8c-81e6-40fc89fa423c)
)
(fp_line (start -1.3 -2.8) (end -1.7 -3.2) (layer "F.SilkS") (width 0.127) (tstamp 2ed904b0-2f6f-46f6-a7d0-32a2b2ab53e9))
(fp_line (start -2.5 -1.6) (end -2.5 -2.5) (layer "F.SilkS") (width 0.127) (tstamp 348b26de-ffdf-4abc-887b-15c20a89da1e))
(fp_line (start -1.6 -2.5) (end -1.3 -2.8) (layer "F.SilkS") (width 0.127) (tstamp 3a96a48a-a92a-4cfa-83c2-c9eed2634118))
(fp_line (start -1.6 -2.5) (end 2.5 -2.5) (layer "F.SilkS") (width 0.127) (tstamp 42d14ce4-a929-40e4-82a4-1f2486f373bc))
(fp_line (start -2.5 -1.6) (end -1.6 -2.5) (layer "F.SilkS") (width 0.127) (tstamp 59f81a11-80ab-4ec0-ba08-bc2eb2ae447c))
(fp_line (start -2.5 -2.5) (end -1.6 -2.5) (layer "F.SilkS") (width 0.127) (tstamp 61107044-ad8e-4c0b-9ef0-ef973fdda459))
(fp_line (start -2.5 2.5) (end -2.5 -1.6) (layer "F.SilkS") (width 0.127) (tstamp 69216276-0df4-44e6-9db4-460d17273d67))
(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer "F.SilkS") (width 0.127) (tstamp 85cedbf7-6c66-43a1-9b0c-82c89a0af22d))
(fp_line (start 2.5 2.5) (end -2.5 2.5) (layer "F.SilkS") (width 0.127) (tstamp b2edd215-e4c6-42a2-bbfc-e8d1b3f8e2e8))
(fp_line (start -1.7 -3.2) (end -2.5 -2.5) (layer "F.SilkS") (width 0.127) (tstamp eea23336-679d-4900-bb87-8775d9d37533))
(fp_circle (center 0 0) (end 1.720462 0) (layer "F.SilkS") (width 0.127) (fill none) (tstamp be179388-6d84-4f4c-b00d-556c50cc5707))
(pad "1-VDD" smd rect (at 2.45 1.65 180) (size 1.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 3e78764f-4b68-4c63-8bb3-010c13d2101f))
(pad "2-DOUT" smd rect (at 2.45 -1.65 180) (size 1.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 2ffd1dd2-50fe-4852-8eab-16a0b157f315))
(pad "3-GND" smd rect (at -2.45 -1.65 180) (size 1.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 2960b4d2-7787-4598-beb5-d9c763d28acf))
(pad "4-DIN" smd rect (at -2.45 1.65 180) (size 1.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp f0803c6d-77ef-497e-8c28-823260a18eb6))
)
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