blob: 77fd4d2b378cf69967f2b9c9556d94ff94aba56d (
plain)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
|
(footprint "USB-MICROB" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(descr "Micro USB Package")
(fp_text reference "REF**" (at -1.6 0.35) (layer "F.SilkS")
(effects (font (size 0.70104 0.70104) (thickness 0.06096)) (justify left bottom))
(tstamp f9e7c231-d7d8-4824-a095-04a45cbec110)
)
(fp_text value ">VALUE" (at -1.905 3.175) (layer "F.Fab")
(effects (font (size 0.70104 0.70104) (thickness 0.06096)) (justify left bottom))
(tstamp c5f5af35-2a78-49cb-bdf0-6da733976f56)
)
(fp_line (start -2.2 -1.45) (end 2.2 -1.45) (layer "F.SilkS") (width 0.2032) (tstamp 059174a5-d927-41b1-a1f5-cdbd48d6f36e))
(fp_line (start -3.4 1.45) (end 3.4 1.45) (layer "F.SilkS") (width 0.2032) (tstamp 4ca0ea99-a0e0-415c-8063-08c2dae16c93))
(fp_line (start -3.4 1.45) (end 3.4 1.45) (layer "F.Fab") (width 0.127) (tstamp 1522b700-970b-41b4-9129-e48d65f14cc4))
(fp_line (start -3.4 2.15) (end -3.4 1.45) (layer "F.Fab") (width 0.127) (tstamp 243d7565-5d65-4b07-9800-a88a32becdb5))
(fp_line (start -2.8 2.8) (end 2.75 2.8) (layer "F.Fab") (width 0.127) (tstamp 45de7eaa-a1fa-4f1d-973b-fab2bc314474))
(fp_line (start 3.4 -2.85) (end 3.4 1.45) (layer "F.Fab") (width 0.127) (tstamp 559adb48-44f0-4bd9-98ae-b52530733523))
(fp_line (start 3.4 2.15) (end 4 2.75) (layer "F.Fab") (width 0.2032) (tstamp 5c2df102-6950-402c-a347-35e197deec59))
(fp_line (start 2.2 -1.45) (end 2.2 -2.85) (layer "F.Fab") (width 0.127) (tstamp 78bd8ac2-ac95-4584-be9c-8741897412c5))
(fp_line (start 3 2.15) (end 3.4 2.15) (layer "F.Fab") (width 0.127) (tstamp 7a67c87f-73d7-4317-a25f-ec7c1978401d))
(fp_line (start -3 2.15) (end -3 2.55) (layer "F.Fab") (width 0.127) (tstamp 7dcbbe39-8262-42b7-bd81-4563eb7376a3))
(fp_line (start -2.2 -1.45) (end -2.2 -2.85) (layer "F.Fab") (width 0.127) (tstamp 830cec5b-bd07-42e9-872e-d81f14f59cbe))
(fp_line (start -2.2 -1.45) (end 2.2 -1.45) (layer "F.Fab") (width 0.127) (tstamp 9da55164-f43e-487e-806d-8058c6b1e627))
(fp_line (start 3.4 -2.85) (end 2.2 -2.85) (layer "F.Fab") (width 0.127) (tstamp af6a0edc-d771-487d-af85-a11373774ec7))
(fp_line (start -3.4 1.45) (end -3.4 -2.85) (layer "F.Fab") (width 0.127) (tstamp b8ca1870-f9e0-49ce-8d47-2a4e22b352e8))
(fp_line (start 3 2.6) (end 3 2.15) (layer "F.Fab") (width 0.127) (tstamp ba94c162-cffa-4809-96b7-1e06469ca5b5))
(fp_line (start -3.4 2.15) (end -3 2.15) (layer "F.Fab") (width 0.127) (tstamp d401ed51-b37f-444d-8172-70a64eaf7c21))
(fp_line (start -3.4 -2.85) (end -2.2 -2.85) (layer "F.Fab") (width 0.127) (tstamp f51650f4-3dca-4d01-88d9-96af3dbfb5e0))
(fp_line (start 3.4 1.45) (end 3.4 2.15) (layer "F.Fab") (width 0.127) (tstamp f78e30ce-b4c7-4741-b97a-1e7cf658e929))
(fp_line (start -3.4 2.15) (end -4 2.75) (layer "F.Fab") (width 0.2032) (tstamp fe225a4c-44ec-4f81-92cd-125580a29067))
(fp_arc (start 3 2.599998) (mid 2.913661 2.748325) (end 2.75 2.8) (layer "F.Fab") (width 0.127) (tstamp 5391b9ce-53bc-407a-a02e-6c82a0dcc75a))
(fp_arc (start -2.799998 2.8) (mid -2.948325 2.713661) (end -3 2.55) (layer "F.Fab") (width 0.127) (tstamp 545c5da4-8236-4856-b144-ad178fd7ef21))
(pad "D+" smd rect (at 0 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 5a02551d-6198-4616-b0e2-14aa29e9743d))
(pad "D-" smd rect (at -0.65 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 2393cfc5-babf-46e3-9b72-b572b277e9a9))
(pad "GND" smd rect (at 1.3 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 63ca37d9-035e-4fb3-bbf2-64f99dc7fb97))
(pad "ID" smd rect (at 0.65 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 7a36a6f9-0d2c-499b-a72c-8a9fdf5a938e))
(pad "MT1" smd rect (at -3.775 0) (size 1.75 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 382e8250-f812-40bc-ab81-662a520332bf))
(pad "MT2" smd rect (at 3.775 0) (size 1.75 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 675ae5db-3146-4f0f-802c-6f8ae38bad9f))
(pad "MT3" smd rect (at 3.1 -2.55) (size 2.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 886c46d7-aba8-459a-8d2b-9298817c5d19))
(pad "MT4" smd rect (at -3.1 -2.55) (size 2.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp 631481b7-6b2e-41c5-90f5-0858967bc2cc))
(pad "P$1" smd rect (at -1.075 0) (size 1.65 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp f65b04b1-be54-445c-b644-ff547e2dbe21))
(pad "P$2" smd rect (at 1.075 0) (size 1.65 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp d13f9309-7129-47f0-8527-555f8e708960))
(pad "VBUS" smd rect (at -1.3 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0508) (tstamp d3cd4242-7525-4574-8597-212a77bd52bb))
)
|
