New v2 badge in kicad

1 files changed, 414 insertions, 0 deletions

diff --git a/laser-tag badge v2/laser-tag.pretty/2X16.kicad_mod b/laser-tag badge v2/laser-tag.pretty/2X16.kicad_mod
new file mode 100644
index 0000000..1207434
--- /dev/null
+++ b/laser-tag badge v2/laser-tag.pretty/2X16.kicad_mod
@@ -0,0 +1,414 @@
+(footprint "2X16" (version 20211014) (generator pcbnew)
+  (layer "F.Cu")
+  (tedit 0)
+  (descr "<b>PIN HEADER</b>")
+  (fp_text reference "REF**" (at -20.32 -3.175) (layer "F.SilkS")
+    (effects (font (size 1.143 1.143) (thickness 0.127)) (justify left bottom))
+    (tstamp 31d5e03c-a946-40a3-8779-4473b458db17)
+  )
+  (fp_text value ">VALUE" (at -20.32 4.445) (layer "F.Fab")
+    (effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
+    (tstamp 24d26db0-eb64-4c2b-a852-507f6de2be99)
+  )
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+    (solder_mask_margin 0.0508) (tstamp a09c9ab8-c533-438b-bc75-ede0f9c08381))
+  (pad "28" thru_hole roundrect (at 13.97 -1.27) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
+    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
+    (solder_mask_margin 0.0508) (tstamp 93e6621e-4450-4e11-8787-e2da6fc6cfb1))
+  (pad "29" thru_hole roundrect (at 16.51 1.27) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
+    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
+    (solder_mask_margin 0.0508) (tstamp be442d6a-1918-4845-bf30-82769c8f0ae6))
+  (pad "30" thru_hole roundrect (at 16.51 -1.27) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
+    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
+    (solder_mask_margin 0.0508) (tstamp 04121d23-9b3c-40e2-9f19-1d828c7c3767))
+  (pad "31" thru_hole roundrect (at 19.05 1.27) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
+    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
+    (solder_mask_margin 0.0508) (tstamp eef0d56a-d1cc-423c-859c-6abdb656fc13))
+  (pad "32" thru_hole roundrect (at 19.05 -1.27) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
+    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
+    (solder_mask_margin 0.0508) (tstamp 3ff289bd-57b9-4dae-abd4-1c42e270663b))
+)