diff options
author | David Barksdale <amatus@amat.us> | 2021-09-04 16:54:48 -0500 |
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committer | David Barksdale <amatus@amat.us> | 2021-09-04 16:54:48 -0500 |
commit | 63f331c88a25eae49da90786431231461cac6aac (patch) | |
tree | b053fcb6cd71c6fc2917416dbdd603560d2981cf | |
parent | a1e06b691fe5b9192585ba68ef32c7e2e9d1a716 (diff) |
-rw-r--r-- | maccad_format.txt | 85 |
1 files changed, 85 insertions, 0 deletions
diff --git a/maccad_format.txt b/maccad_format.txt new file mode 100644 index 0000000..340fe28 --- /dev/null +++ b/maccad_format.txt @@ -0,0 +1,85 @@ +Layers + 1 Top Silk + 2 Com Pads + 3 Top + 4 Inner 1 + 5 Inner 2 + 6 Bottom + 7 Bottom Silk + 8 Top Pads + 9 Bot Pads +Virtual layers +10 Top Mask +11 Bot Mask +12 Com Mask +13 Drill + +Entity format +16 big endian 2-byte words: +0 to 4 are parameters +5 is unknown +6 is the entity type +7 is the veritcal position +8 is the horizontal position +9 is delta V +10 is delta H + +Entities + 0 Round PAD: Pad OD, Pad ID + 1 H-Oval PAD: Pad OD, Pad ID + 2 V-Oval PAD: Pad OD, Pad ID + 3 Square PAD: Pad OD, Pad ID + 4 H-Rect PAD: Pad OD, Pad ID + 5 V-Rect PAD: Pad OD, Pad ID + 6 Line: _, _, LineWidth + 7 Framed Rectangle: _, _, LineWidth + 8 V-DIP Pad Spacing = 100: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style + 9 H-DIP Pad Spacing = 100: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +10 Text: Text Size, _, _, _, Font # +11 Drill Hole: Pad OD +12 V-DB Connector: _, Pad ID, _, Pins +13 H-DB Connector: _, Pad ID, _, Pins +14 Transistor PAD: _, Pad ID, _, Pins +15 System Use ONLY!!!!! +16 Framed Oval: _, _, LineWidth (always a circle) +17 TARGET: Pad OD, Pad ID +18 V-DB Connector Mirrored: _, Pad ID, _, Pins +19 H-DB Connector Mirrored: _, Pad ID, _, Pins +20 V-DIP Pad Spacing = 70: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +21 H-DIP Pad Spacing = 70: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +22 SMT V-DIP Pad Spacing = 50: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +23 SMT H-DIP Pad Spacing = 50: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +24 SMT Array: Pad Width, _, Pad Length, SMT Type +25 MFP Array: Pad Width, _, Pad Length, SMT Type +26 Solid Rect: _, _, LineWidth +27 Solid Oval: _, _, LineWidth +... +78 V-DIP Pad Spacing = 50: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +79 H-DIP Pad Spacing = 50: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +80 V-DIP Pad Spacing = 40: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +81 H-DIP Pad Spacing = 40: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +82 V-DIP Pad Spacing = 25: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style +83 H-DIP Pad Spacing = 25: Pad ID, InLine Space, Pad OD, Pins/2, Pad Style + +SMT Array Types + 1 16 pin .250 Sq LCC + 2 16 pin .300 Sq LCC + 3 18 pin .250 Sq LCC + 4 18 pin .350 Rt LCC + 5 18 pin .410 Rt LLC [sic] + 6 20 pin .350 Sq LCC + 7 22 pin .340 Sq LCC + 8 24 pin .340 Sq LCC + 9 24 pin .400 Sq LCC +10 28 pin .400 Sq LCC +11 28 pin .450 Sq LCC +12 28 pin .550 Rt LCC +13 32 pin .550 Sq LCC +14 44 pin .650 Sq LCC +15 52 pin .750 Sq LCC + +MFP Array Types +1 28 pin +2 40 pin +3 44 pin +4 68 pin |