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git://git.kernel.org/pub/scm/linux/kernel/git/balbi/usb into usb-next
USB: transceiver changes for 3.4
Here we have a big rework done by Heikki Krogerus (thanks) which
splits OTG functionality away from transceivers.
We have known for quite a long time that struct otg_transceiver was
a bad name for the structure, considering transceiver is far from
being OTG-specific (see 4e67185).
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Use the new usb_phy_* functions with transceiver
operations instead of the old otg functions.
Includes fixes from Sascha Hauer.
Signed-off-by: Heikki Krogerus <heikki.krogerus@linux.intel.com>
Acked-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Pavankumar Kondeti <pkondeti@codeaurora.org>
Acked-by: Li Yang <leoli@freescale.com>
Acked-by: Alan Stern <stern@rowland.harvard.edu>
Reviewed-by: Marek Vasut <marek.vasut@gmail.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Use struct usb_otg members with OTG specific functions instead
of usb_phy members.
[ balbi@ti.com: added a missing change on musb_gadget.c to avoid
a compile error on a later patch ]
Signed-off-by: Heikki Krogerus <heikki.krogerus@linux.intel.com>
Reviewed-by: Marek Vasut <marek.vasut@gmail.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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There's really no point in doing all that
initcall trickery when we can safely let
udev handle module probing for us.
Remove all of that trickery, by moving everybody
to module_init() and making proper use of
platform_device_register() rather than
platform_device_probe().
Tested-by: Rajashekhara, Sudhakar <sudhakar.raj@ti.com>
Tested-by: Tasslehoff Kjappfot <tasskjapp@gmail.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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commit de47725 (include: replace linux/module.h
with "struct module" wherever possible) introduced
a compilation breaked when it removed <linux/module.h>
from <linux/device.h> which musb glue layers were
(mistakenly) relying on.
Include that header to fix the compile error.
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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the MUSB IP is always OTG, so there's no point
in adding so many ifdefs on the code. Drop those
and always compile the driver for OTG support.
This also allows us to drop the useless "driver
mode" choice. For doing that, we need to make
musb depend on both Host and Peripheral side.
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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We have a generic way of enabling/disabling
different debug messages on a driver called
DYNAMIC_PRINTK. Anyone interested in enabling
just part of the debug messages, please read
the documentation under:
Documentation/dynamic-debug-howto.txt
for information on how to use that great
infrastructure.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Commit 3dacdf11 "usb: factor out state_string() on otg drivers"
broke building musb drivers since there is already another
otg_state_string() function in musb drivers, but with different
prototype. Fix musb drivers to use common otg_state_string(), too.
Also provide a nop for otg_state_string() if CONFIG_USB_OTG_UTILS
is not defined.
Signed-off-by: Anatolij Gustschin <agust@denx.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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that's not used anymore. So let's drop it.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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musb core doesn't need to know about platform
specific details. So start moving clock
handling to platform glue layer and make
musb core agnostic about that.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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... then we don't need to export any symbols
from glue layer to musb_core.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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that structure currently only holds a device
pointer to our own platform_device and musb's
platform_device, but soon it will hold pointers
to our clock structures and glue-specific bits
and pieces.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Just adding its own platform_driver, not really
using it yet.
When all HW glue layers are converted, more patches
will come to split power management code from musb_core
and move it completely to HW glue layer.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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preparing to a big refactor on musb code. We need
to be able to compile in all glue layers (or at
least all ARM-based ones) together and have a
working binary.
While preparing for that, we move every glue
layer to export only one symbol, which is
a struct musb_platform_ops, and make all
other functions static.
Later patches will come to allow for compiling
all glue layers together and have a working
binary.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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