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authorLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
committerLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
commit29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch)
tree8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /drivers/hwmon/Makefile
parent125c4c706b680c7831f0966ff873c1ad0354ec25 (diff)
parentc072fed95c9855a920c114d7fa3351f0f54ea06e (diff)
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'drivers/hwmon/Makefile')
-rw-r--r--drivers/hwmon/Makefile1
1 files changed, 0 insertions, 1 deletions
diff --git a/drivers/hwmon/Makefile b/drivers/hwmon/Makefile
index a62ce17ddbf..8d5fcb5e8e9 100644
--- a/drivers/hwmon/Makefile
+++ b/drivers/hwmon/Makefile
@@ -50,7 +50,6 @@ obj-$(CONFIG_SENSORS_DS1621) += ds1621.o
obj-$(CONFIG_SENSORS_EMC1403) += emc1403.o
obj-$(CONFIG_SENSORS_EMC2103) += emc2103.o
obj-$(CONFIG_SENSORS_EMC6W201) += emc6w201.o
-obj-$(CONFIG_SENSORS_EXYNOS4_TMU) += exynos4_tmu.o
obj-$(CONFIG_SENSORS_F71805F) += f71805f.o
obj-$(CONFIG_SENSORS_F71882FG) += f71882fg.o
obj-$(CONFIG_SENSORS_F75375S) += f75375s.o