Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
 "This time, the biggest change is the work of representing hardware
  thermal properties in device tree infrastructure.

  This work includes the introduction of a device tree bindings for
  describing the hardware thermal behavior and limits, and also a parser
  to read and interpret the data, and build thermal zones and thermal
  binding parameters.  It also contains three examples on how to use the
  new representation on sensor devices, using three different drivers to
  accomplish it.  One driver is in thermal subsystem, the TI SoC
  thermal, and the other two drivers are in hwmon subsystem.

  Actually, this would be the first step of the complete work because we
  still need to check other potential drivers to be converted and then
  validate the proposed API.  But the reason why I include it in this
  pull request is that, first, this change does not hurt any others
  without using this approach, second, the principle and concept of this
  change would not break after converting the remaining drivers.  BTW,
  as you can see, there are several points in this change that do not
  belong to thermal subsystem.  Because it has been suggested by Guenter
  R that in such cases, it is recommended to send the complete series
  via one single subsystem.

  Specifics:

   - representing hardware thermal properties in device tree
     infrastructure

   - fix a regression that the imx thermal driver breaks system suspend.

   - introduce ACPI INT3403 thermal driver to retrieve temperature data
     from the INT3403 ACPI device object present on some systems.

   - introduce debug statement for thermal core and step_wise governor.

   - assorted fixes and cleanups for thermal core, cpu cooling, exynos
     thrmal, intel powerclamp and imx thermal driver"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
  thermal: remove const flag from .ops of imx thermal
  Thermal: update thermal zone device after setting emul_temp
  intel_powerclamp: Fix cstate counter detection.
  thermal: imx: add necessary clk operation
  Thermal cpu cooling: return error if no valid cpu frequency entry
  thermal: fix cpu_cooling max_level behavior
  thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
  thermal: debug: add debug statement for core and step_wise
  thermal: imx_thermal: add module device table
  drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
  thermal:samsung: fix compilation warning
  thermal: imx: correct suspend/resume flow
  thermal: exynos: fix error return code
  Thermal: ACPI INT3403 thermal driver
  MAINTAINERS: add thermal bindings entry in thermal domain
  arm: dts: make OMAP4460 bandgap node to belong to OCP
  arm: dts: make OMAP443x bandgap node to belong to OCP
  arm: dts: add cooling properties on omap5 cpu node
  arm: dts: add omap5 thermal data
  arm: dts: add omap5 CORE thermal data
  ...

6 files changed, 149 insertions, 14 deletions

diff --git a/arch/arm/boot/dts/omap4-cpu-thermal.dtsi b/arch/arm/boot/dts/omap4-cpu-thermal.dtsi
new file mode 100644
index 00000000000..cb9458feb2e
--- /dev/null
+++ b/arch/arm/boot/dts/omap4-cpu-thermal.dtsi
@@ -0,0 +1,41 @@
+/*
+ * Device Tree Source for OMAP4/5 SoC CPU thermal
+ *
+ * Copyright (C) 2013 Texas Instruments Incorporated - http://www.ti.com/
+ * Contact: Eduardo Valentin <eduardo.valentin@ti.com>
+ *
+ * This file is licensed under the terms of the GNU General Public License
+ * version 2.  This program is licensed "as is" without any warranty of any
+ * kind, whether express or implied.
+ */
+
+#include <dt-bindings/thermal/thermal.h>
+
+cpu_thermal: cpu_thermal {
+	polling-delay-passive = <250>; /* milliseconds */
+	polling-delay = <1000>; /* milliseconds */
+
+			/* sensor       ID */
+        thermal-sensors = <&bandgap     0>;
+
+        trips {
+                cpu_alert0: cpu_alert {
+                        temperature = <100000>; /* millicelsius */
+                        hysteresis = <2000>; /* millicelsius */
+                        type = "passive";
+                };
+                cpu_crit: cpu_crit {
+                        temperature = <125000>; /* millicelsius */
+                        hysteresis = <2000>; /* millicelsius */
+                        type = "critical";
+                };
+        };
+
+	cooling-maps {
+		map0 {
+			trip = <&cpu_alert0>;
+			cooling-device =
+				<&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+		};
+	};
+};
diff --git a/arch/arm/boot/dts/omap443x.dtsi b/arch/arm/boot/dts/omap443x.dtsi
index bcf455efe18..ab607a19a61 100644
--- a/arch/arm/boot/dts/omap443x.dtsi
+++ b/arch/arm/boot/dts/omap443x.dtsi
@@ -12,7 +12,7 @@
 
 / {
 	cpus {
-		cpu@0 {
+		cpu0: cpu@0 {
 			/* OMAP443x variants OPP50-OPPNT */
 			operating-points = <
 				/* kHz    uV */
@@ -22,12 +22,25 @@
 				1008000 1375000
 			>;
 			clock-latency = <300000>; /* From legacy driver */
+
+			/* cooling options */
+			cooling-min-level = <0>;
+			cooling-max-level = <3>;
+			#cooling-cells = <2>; /* min followed by max */
 		};
 	};
 
-	bandgap {
-		reg = <0x4a002260 0x4
-		       0x4a00232C 0x4>;
-		compatible = "ti,omap4430-bandgap";
+	thermal-zones {
+		#include "omap4-cpu-thermal.dtsi"
+	};
+
+	ocp {
+		bandgap: bandgap {
+			reg = <0x4a002260 0x4
+			       0x4a00232C 0x4>;
+			compatible = "ti,omap4430-bandgap";
+
+			#thermal-sensor-cells = <0>;
+		};
 	};
 };
diff --git a/arch/arm/boot/dts/omap4460.dtsi b/arch/arm/boot/dts/omap4460.dtsi
index c2f0f39b5a2..11566bed003 100644
--- a/arch/arm/boot/dts/omap4460.dtsi
+++ b/arch/arm/boot/dts/omap4460.dtsi
@@ -12,7 +12,7 @@
 / {
 	cpus {
 		/* OMAP446x 'standard device' variants OPP50 to OPPTurbo */
-		cpu@0 {
+		cpu0: cpu@0 {
 			operating-points = <
 				/* kHz    uV */
 				350000  1025000
@@ -20,6 +20,11 @@
 				920000  1313000
 			>;
 			clock-latency = <300000>; /* From legacy driver */
+
+			/* cooling options */
+			cooling-min-level = <0>;
+			cooling-max-level = <2>;
+			#cooling-cells = <2>; /* min followed by max */
 		};
 	};
 
@@ -30,12 +35,20 @@
 		ti,hwmods = "debugss";
 	};
 
-	bandgap {
-		reg = <0x4a002260 0x4
-		       0x4a00232C 0x4
-		       0x4a002378 0x18>;
-		compatible = "ti,omap4460-bandgap";
-		interrupts = <0 126 IRQ_TYPE_LEVEL_HIGH>; /* talert */
-		gpios = <&gpio3 22 0>; /* tshut */
+	thermal-zones {
+		#include "omap4-cpu-thermal.dtsi"
+	};
+
+	ocp {
+		bandgap: bandgap {
+			reg = <0x4a002260 0x4
+			       0x4a00232C 0x4
+			       0x4a002378 0x18>;
+			compatible = "ti,omap4460-bandgap";
+			interrupts = <0 126 IRQ_TYPE_LEVEL_HIGH>; /* talert */
+			gpios = <&gpio3 22 0>; /* tshut */
+
+			#thermal-sensor-cells = <0>;
+		};
 	};
 };
diff --git a/arch/arm/boot/dts/omap5-core-thermal.dtsi b/arch/arm/boot/dts/omap5-core-thermal.dtsi
new file mode 100644
index 00000000000..19212ac6eef
--- /dev/null
+++ b/arch/arm/boot/dts/omap5-core-thermal.dtsi
@@ -0,0 +1,28 @@
+/*
+ * Device Tree Source for OMAP543x SoC CORE thermal
+ *
+ * Copyright (C) 2013 Texas Instruments Incorporated - http://www.ti.com/
+ * Contact: Eduardo Valentin <eduardo.valentin@ti.com>
+ *
+ * This file is licensed under the terms of the GNU General Public License
+ * version 2.  This program is licensed "as is" without any warranty of any
+ * kind, whether express or implied.
+ */
+
+#include <dt-bindings/thermal/thermal.h>
+
+core_thermal: core_thermal {
+	polling-delay-passive = <250>; /* milliseconds */
+	polling-delay = <1000>; /* milliseconds */
+
+			/* sensor       ID */
+	thermal-sensors = <&bandgap     2>;
+
+	trips {
+		core_crit: core_crit {
+			temperature = <125000>; /* milliCelsius */
+			hysteresis = <2000>; /* milliCelsius */
+			type = "critical";
+		};
+	};
+};
diff --git a/arch/arm/boot/dts/omap5-gpu-thermal.dtsi b/arch/arm/boot/dts/omap5-gpu-thermal.dtsi
new file mode 100644
index 00000000000..1b87aca88b7
--- /dev/null
+++ b/arch/arm/boot/dts/omap5-gpu-thermal.dtsi
@@ -0,0 +1,28 @@
+/*
+ * Device Tree Source for OMAP543x SoC GPU thermal
+ *
+ * Copyright (C) 2013 Texas Instruments Incorporated - http://www.ti.com/
+ * Contact: Eduardo Valentin <eduardo.valentin@ti.com>
+ *
+ * This file is licensed under the terms of the GNU General Public License
+ * version 2.  This program is licensed "as is" without any warranty of any
+ * kind, whether express or implied.
+ */
+
+#include <dt-bindings/thermal/thermal.h>
+
+gpu_thermal: gpu_thermal {
+	polling-delay-passive = <250>; /* milliseconds */
+	polling-delay = <1000>; /* milliseconds */
+
+			/* sensor       ID */
+	thermal-sensors = <&bandgap     1>;
+
+	trips {
+		gpu_crit: gpu_crit {
+			temperature = <125000>; /* milliCelsius */
+			hysteresis = <2000>; /* milliCelsius */
+			type = "critical";
+		};
+	};
+};
diff --git a/arch/arm/boot/dts/omap5.dtsi b/arch/arm/boot/dts/omap5.dtsi
index fc3fad56386..ab9a21ae82f 100644
--- a/arch/arm/boot/dts/omap5.dtsi
+++ b/arch/arm/boot/dts/omap5.dtsi
@@ -49,6 +49,10 @@
 				1000000 1060000
 				1500000 1250000
 			>;
+			/* cooling options */
+			cooling-min-level = <0>;
+			cooling-max-level = <2>;
+			#cooling-cells = <2>; /* min followed by max */
 		};
 		cpu@1 {
 			device_type = "cpu";
@@ -57,6 +61,12 @@
 		};
 	};
 
+	thermal-zones {
+		#include "omap4-cpu-thermal.dtsi"
+		#include "omap5-gpu-thermal.dtsi"
+		#include "omap5-core-thermal.dtsi"
+	};
+
 	timer {
 		compatible = "arm,armv7-timer";
 		/* PPI secure/nonsecure IRQ */
@@ -729,13 +739,15 @@
 			};
 		};
 
-		bandgap@4a0021e0 {
+		bandgap: bandgap@4a0021e0 {
 			reg = <0x4a0021e0 0xc
 			       0x4a00232c 0xc
 			       0x4a002380 0x2c
 			       0x4a0023C0 0x3c>;
 			interrupts = <GIC_SPI 126 IRQ_TYPE_LEVEL_HIGH>;
 			compatible = "ti,omap5430-bandgap";
+
+			#thermal-sensor-cells = <1>;
 		};
 	};
 };