(footprint "USB-MICROB" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (descr "Micro USB Package")
  (fp_text reference "REF**" (at -1.6 0.35) (layer "F.SilkS")
    (effects (font (size 0.70104 0.70104) (thickness 0.06096)) (justify left bottom))
    (tstamp f9e7c231-d7d8-4824-a095-04a45cbec110)
  )
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    (effects (font (size 0.70104 0.70104) (thickness 0.06096)) (justify left bottom))
    (tstamp c5f5af35-2a78-49cb-bdf0-6da733976f56)
  )
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  (pad "D+" smd rect (at 0 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 5a02551d-6198-4616-b0e2-14aa29e9743d))
  (pad "D-" smd rect (at -0.65 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 2393cfc5-babf-46e3-9b72-b572b277e9a9))
  (pad "GND" smd rect (at 1.3 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 63ca37d9-035e-4fb3-bbf2-64f99dc7fb97))
  (pad "ID" smd rect (at 0.65 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 7a36a6f9-0d2c-499b-a72c-8a9fdf5a938e))
  (pad "MT1" smd rect (at -3.775 0) (size 1.75 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 382e8250-f812-40bc-ab81-662a520332bf))
  (pad "MT2" smd rect (at 3.775 0) (size 1.75 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 675ae5db-3146-4f0f-802c-6f8ae38bad9f))
  (pad "MT3" smd rect (at 3.1 -2.55) (size 2.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 886c46d7-aba8-459a-8d2b-9298817c5d19))
  (pad "MT4" smd rect (at -3.1 -2.55) (size 2.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 631481b7-6b2e-41c5-90f5-0858967bc2cc))
  (pad "P$1" smd rect (at -1.075 0) (size 1.65 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp f65b04b1-be54-445c-b644-ff547e2dbe21))
  (pad "P$2" smd rect (at 1.075 0) (size 1.65 1.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp d13f9309-7129-47f0-8527-555f8e708960))
  (pad "VBUS" smd rect (at -1.3 -2.675 90) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp d3cd4242-7525-4574-8597-212a77bd52bb))
)